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FR-4 PCB

FR-4: Brominated flame-retardant G-10 successor. Standard PCB epoxy laminate.

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FR-4 PCB
Thermal Stability: Good heat resistance
Dielectric Constant: Typically 4.2–4.8
Mechanical Strength: High rigidity

What is FR-4 PCB?

Material Overview

An FR-4 PCB is a printed circuit board made from a widely used material known as FR-4, which stands for flame-retardant grade 4. The standard is defined by the NEMA, and it refers to a composite material made from woven fiberglass cloth combined with epoxy resin.

Key Benefits

FR-4 offers excellent mechanical strength, good thermal stability, and reliable electrical insulation. Its cost-effectiveness and wide availability make it the industry standard for the majority of PCB applications across consumer, industrial, and commercial sectors.

Precision Solutions

Benlida delivers precision PCB manufacturing with advanced equipment and strict quality control, ensuring consistent performance from single-layer boards to complex multilayer designs tailored to your specifications.

Our FR-4 PCB Manufacturing Capabilities

At Benlida, we deliver high-precision FR-4 PCB manufacturing with advanced technology, strict quality control, and fast, reliable production from prototype to volume.

Our FR-4 PCB Manufacturing Capabilities
Layer Count 1–32 layers
Controlled Impedance Supported (4–32 layers)
Impedance Tolerance ±10% (±5Ω if ≤50Ω)
Max Board Size Up to 670 × 600 mm
Min Board Size 3 × 3 mm
Outer Copper Thickness 1–2 oz (up to 4.5 oz for 2-layer)
Inner Copper Thickness 1–2 oz (up to 4.5 oz for 2-layer)
Gold Finger Bevel Supported
Surface Finish HASL, Lead-free HASL, ENIG
Min Via Size 0.15 mm (hole) / 0.25 mm (pad)
Hole Tolerance Plated: +0.13/-0.08 mm; Non-plated: ±0.2 mm
Min Track Width/Spacing 0.10 / 0.10 mm (standard)
Min Plated Slot 0.5 mm
Min Non-Plated Slot 1.0 mm
Min BGA Pad 0.25 mm
Backdrill Supported (≥4 layers)

Types of FR-4 PCBs

FR-4 PCB by Benlida: Durable, Affordable, and Built for Every Electronic Need.

Standard FR-4 PCB

Reliable and cost-effective, ideal for general electronic devices and everyday applications with high quality.

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High Tg FR-4 PCB

Designed for high-temperature environments, offering enhanced thermal stability and mechanical performance.

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High-Frequency FR-4 PCB

Optimized for fast signal transmission and reduced loss in RF and high-speed applications.

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Multilayer FR-4 PCB

Multiple layers enable compact, complex circuits for advanced electronics and high-density designs.

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HDI FR-4 PCB

High-density interconnect PCB for miniaturized devices with fine lines and microvias to match your demand.

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FR-4 PCB Manufacturing Process

Benlida FR-4 PCB: Expertly Crafted with Precision at Every Step, from Design and Lamination to Testing and Delivery.

1

PCB Design & DFM Review

Ensure optimal design and manufacturability before production to prevent errors and improve performance.

2

Material Preparation

Select and cut FR-4 substrate sheets to the required size and specifications.

3

Inner Layer Imaging

Transfer circuit patterns onto inner copper layers using photolithography for precise circuit definition.

4

Etching Process

Remove unwanted copper from inner layers to create the desired circuit patterns.

5

Layer Lamination

Bond multiple inner layers together under heat and pressure to form the multilayer board structure.

6

Drilling & Via Formation

Drill holes for component leads and electrical connections between PCB layers.

7

Copper Plating

Plate drilled holes and surface areas with copper to ensure electrical conductivity.

8

Solder Mask Application

Apply protective solder mask to prevent short circuits and protect traces.

9

Surface Finishing

Apply finishes like HASL or ENIG to protect copper and improve solderability.

10

Electrical Testing & Inspection

Test all circuits for continuity and defects to ensure quality and reliability.

FR-4 PCB Surface Finish

Benlida FR-4 PCB Surface Finishes: Perfect Protection, Superior Solderability, Every Time.

HASL

A traditional, cost-effective finish using molten solder, ideal for general-purpose PCBs.

Lead-Free HASL

Environmentally friendly version of HASL, meeting RoHS standards for lead-free electronics.

ENIG

Provides a flat, gold-coated surface for excellent solderability and reliable high-frequency performance.

Immersion Tin

Offers uniform, smooth surface with good solderability for short to medium-term applications.

Immersion Silver

Provides high conductivity and excellent surface planarity for precision assembly and fine-pitch parts.

OSP

Organic solderability preservative protects copper while remaining flat, perfect for fine-pitch components.

FR-4 PCB Surface Finish

FR-4 PCB Design Guides

Benlida FR-4 PCB Stack-Up: Engineered for Precision, Signal Integrity, and High-Performance Designs.

FR-4 PCB design guidelines help engineers achieve reliable performance, stable signal transmission, and efficient manufacturability. By focusing on key design factors, it is possible to optimize both electrical and thermal performance.

FR-4 PCB design guidelines help engineers achieve reliable performance, stable signal transmission, and efficient manufacturability. By focusing on key design factors, it is possible to optimize both electrical and thermal performance.

Trace Width Considerations

Select appropriate trace widths to support current requirements and maintain controlled impedance.

Via Design

Optimize via size and structure to ensure reliable connections and minimize signal loss.

Thermal Management

Incorporate heat dissipation strategies such as copper pours and thermal vias to manage temperature effectively.

Layer Stack Planning

Design a well-structured stack-up to separate signal, power, and ground layers for improved stability.

Impedance Control Tips

Apply controlled impedance design to ensure consistent signal quality in high-speed circuits.

2-layer FR-4 stack-up

A basic configuration suitable for simple circuits with low component density and standard signal routing.

4-layer FR-4 stack-up

Provides additional layers for power and ground planes, improving signal performance and reducing EMI.

6-layer FR-4 stack-up

Offers more routing flexibility, better signal integrity, and supports complex high-speed designs.

Controlled impedance design

Ensures precise impedance values for high-frequency signals, critical in RF and high-speed digital circuits.

Signal integrity considerations

Optimizes layer arrangement, trace width, and spacing to minimize noise, crosstalk, and signal degradation.

FR-4 vs Other PCB Materials

Step into our state-of-the-art manufacturing facility where precision meets efficiency. Every corner reflects our commitment to high-quality production, seamless workflow and strict quality control — delivering excellence in every PCB we build.

FR-4 PCB
Rogers PCB
FR-4
Aluminum PCB
Polyimide PCB
Dielectric Constant (εr) 2.2–10 (material dependent)
Dielectric Constant (εr) 4.2–4.8
Dielectric Constant (εr) 4.0–4.5
Dielectric Constant (εr) 3.5–4.5
Thermal Conductivity 0.6–0.9 W/m·K
Thermal Conductivity 0.3–0.4 W/m·K
Thermal Conductivity 1.0–2.0 W/m·K
Thermal Conductivity 0.12–0.20 W/m·K
Glass Transition Temperature (Tg) 280–300 °C
Glass Transition Temperature (Tg) 130–140 °C
Glass Transition Temperature (Tg) 130–140 °C
Glass Transition Temperature (Tg) 260–300 °C
Maximum Operating Temperature 200–300 °C
Maximum Operating Temperature ~130 °C
Maximum Operating Temperature ~130 °C
Maximum Operating Temperature 260–300 °C
Mechanical Flexibility Rigid
Mechanical Flexibility Rigid
Mechanical Flexibility Rigid
Mechanical Flexibility Flexible
Thermal Expansion (CTE) 9–12 ppm/°C (X/Y)
Thermal Expansion (CTE) 14–17 ppm/°C (X/Y)
Thermal Expansion (CTE) 15–20 ppm/°C (X/Y)
Thermal Expansion (CTE) 20–30 ppm/°C
Applications High-frequency, RF, microwave
Applications General electronics, consumer, industrial
Applications Power electronics, LED lighting
Applications Flexible circuits, high-temp electronics

Why Choose Benlida for PCB Manufacturing?

Choose Benlida for precision PCB and PCBA manufacturing—delivering fast turnaround, consistent quality, and reliable performance from prototype to production.

Experienced Manufacturing

18 years of PCB manufacturing experience. Authoritative manufacturing team delivering consistent quality at every scale.

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Experienced Manufacturing

Advanced Quality Control

Comprehensive inspection processes including AOI, X-ray, and functional testing ensure every board meets the highest standards.

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Fast Turnaround

Flexible production schedules with rapid prototype delivery. From design to finished PCB in record time without compromising quality.

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Global Supply Chain

Trusted component sourcing from verified suppliers worldwide, ensuring authenticity and availability for every project.

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Turn Your Dreams Into Reality

Getting a custom PCB made is simple with Benlida. Submit your design files or project details, and our team will provide a fast, accurate quote tailored to your requirements. Whether it's a prototype or large-scale production, we make the process easy and efficient.

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