Custom Rigid-Flex PCB Fabrication
Custom Rigid-Flex PCB Manufacturing
Benlida provides custom rigid-flex PCB and flex-rigid PCB solutions with precision manufacturing capabilities, delivering reliable PCB products from prototypes to high-volume production for various industries.
Define the Rigid and Flex Regions
Include Your Bend Requirements
What is Rigid-Flex PCB?
Overview
Rigid Flex PCB is a kind of printed circuit board where rigid and flexible circuit technologies have been integrated in one board. Rigid sections are made using ordinary PCB material such as FR4, whereas the flexible sections are made using bendable materials such as polyimide. At the same time, being an experienced rigid flex pcb supplier, we can offer you customized rigid flex PCB solutions for your projects.
Advantages
Our solutions help you save space and weight when you compare them with separate rigid and flexible boards. The use of our solutions helps you reduce the number of connectors and cables, which increases reliability and durability. Our solutions are perfect for projects with a high level of performance.
Applications
Rigid-flex PCB technology is widely used in compact electronic devices such as smartphones, wearables, and medical equipment. It is also suitable for high-density or 3D configurations where space is limited, providing flexible design options and reliable electrical connections.
Related services and board types: Explore our PCB Manufacturing Services or compare Flexible PCB options.
Prepare Your Rigid-Flex RFQ
Describe both the electrical design and the mechanical use of the flex section. Identify missing information so it can be addressed during review.
Core project information
- Fabrication data, such as Gerber or ODB++, plus NC drill files. Confirm the transfer format before sending files.
- Fabrication drawing with part number, revision, units, dimensions, and tolerances.
- Complete stack-up with rigid and flex regions, conductive layers, material requirements, copper type, and base or finished copper thickness.
- Finished rigid thickness and complete flex thickness, with tolerances.
- Flat and folded drawings with bend zones, inside radius, angle, direction, and use category.
- Solderable-pad and connector-contact finish requirements.
- Quantity by revision, target delivery date, and delivery destination.
For engineering review
- Movement cycles, frequency, travel, temperature, and environment.
- Impedance targets, tolerances, reference layers, and required reports.
- Connector or ZIF-tail details, local stiffeners, adhesive, and final thickness.
- Via structures, HDI or backdrill requests, keepouts, tooling, and panelization.
- Required inspection methods, sample plans, acceptance criteria, and reports. Identify the applicable technical specification and revision in the drawing or order.
For assembled boards
For PCB assembly services, also prepare the BOM, placement file, and assembly drawing.
Not all details are final?
Describe the available space, connection requirements, and intended movement. Mark undecided items rather than substituting assumed values.
If your files are confidential, describe the project first and ask about the file-sharing arrangements before sending them.
Rigid-Flex Structures for Engineering Review
Start with the electrical connections and final mechanical shape. The layer construction and the way the flex region will move are separate decisions. The following descriptions explain design options; they do not define a universal manufacturing range.
Conventional Rigid-Flex PCB Structure
The traditional rigid-flex PCB includes rigid sections of boards together with flexible circuits using a normal layered structure. Such a structure is characterized by its compromise between mechanical and flexibility characteristics. For background on layered board construction, see our multilayer PCB construction overview.
Multilayer Flexible Circuit Structure
The structure of a multilayer flexible circuit has several layers of flex circuits, which provide an option for more complicated routing and denser circuitry. Increased design flexibility is achieved in this way, and such a structure is mostly applied in projects that involve lightweight construction, three-dimensional designs, or limited space for mounting.
Advanced Asymmetrical Stackup Structure
The advanced structure of an asymmetrical stackup consists of having different layer configurations or different materials on both sides of the PCB, and this structure gives additional design flexibility for complex rigid-flex PCBs with certain electrical or space requirements.
Rigid-Flex PCB with HDI Technology
HDI technology, when combined with the rigid-flex PCB, gives the benefits of fine lines, small vias, and high component density. It is ideal for electronic products that need miniaturization. For additional context on microvias and fine routing, review our HDI design requirements.
Key Features of Rigid-Flex PCB
Space-Saving Design
Rigid-flex PCB consists of rigid boards and flexible circuits integrated into one PCB, eliminating connectors and cables and providing more space in small electronic devices.
Lightweight and Compact Structure
Combining many circuit connections in one PCB, rigid-flex PCB makes devices lighter and helps to develop thinner products.
Enhanced Reliability
There are fewer connectors and solder joints in this type of PCB, which guarantees reliable connections and increases the durability of the PCB in any environment.
Flexible 3D Design Capability
The flexible sections allow the PCB to be bent or folded according to product requirements, making it suitable for complex three-dimensional and space-limited designs.
Improved Mechanical Durability
The advantage of rigid-flex PCB is that it provides improved resistance to vibration, movement, and mechanical forces in comparison with conventional PCB assemblies.
Wide Application Compatibility
Rigid-flex PCB assembly technology is used for the production of medical instruments, portable electronics, consumer goods, and many other products where reliability and flexibility of the design are needed.
Our Rigid-Flex PCB Manufacturing Capabilities
At Benlida, we support rigid-flex PCB production with 1–16 layer capabilities, fine line processing, controlled impedance, and multiple surface finish options to meet different design requirements. As an experienced rigid flex PCB supplier, we provide reliable flex-rigid PCB solutions with precise manufacturing standards, supporting both prototype development and volume production.
Layer Count
1-16 layers
Impedance Tolerance
±10% (+5Ω if <50Ω)
Min Board Size
3×3 mm
Inner Copper Thickness
1-2 oz (up to 4.5 oz for 2-layer)
Surface Finish
HASL, Lead-free HASL, ENIG
Hole Tolerance
Plated: +0.13/-0.08 mm; Non-plated: ±0.2 mm
Min Plated Slot
0.5 mm
Min BGA Pad
0.25 mm
Controlled Impedance
Supported (4-16 layers) If your project also involves RF or microwave signals, review these high-frequency PCB material considerations.
Max Board Size
Up to 670 × 600 mm
Outer Copper Thickness
1-2 oz (up to 4.5 oz for 2-layer)
Gold Finger Bevel
Supported
Min Via Size
0.15 mm (hole) /0.25 mm (pad)
Min Track Width/Spacing
0.10/0.10 mm (standard)
Min Non-Plated Slot
1.0 mm
Backdrill
Supported (up to 16 layers)
Rigid-flex PCB Design Guides
Rigid-flex PCB technology is commonly employed in small-scale electronic gadgets, including smartphones, wearable devices, and biomedical equipment. Moreover, this technology can be applied in high-density designs or 3D designs where there is not much space available.
Designing a rigid-flex PCB requires careful planning to balance flexibility, durability, and electrical performance. Key guidelines include:
Optimize Bend Areas
State whether the board bends during installation, moves occasionally during servicing, or flexes repeatedly in operation. Define the inside bend radius, complete flex thickness, angle, direction, and final shape. Repeated-motion designs also need cycles, frequency, travel, and environmental conditions. Confirm a representative validation plan before making a service-life claim.
Layer Stackup Design
Show one coordinated stack-up with the layers present in each region. Identify copper continuity, rigid and flex finished thicknesses, coverlay, bonding layers, and rigid-to-flex boundaries.
Trace Routing
Review trace direction relative to the bend axis, smooth width transitions, copper distribution, and local strain. Keep vias, pads, and other stress concentrators out of the active bend zone unless the specific construction has been approved. Define transition clearances on the drawing rather than applying one generic rule to every design.
Component Placement
Use rigid regions for component mounting where practical. If components or connectors require local flex support, define the stiffener, adhesive, finished thickness, and assembly fixture. Keep the mounting load and support edge clear of the active bend zone, subject to engineering review.
Designing a rigid-flex PCB requires careful planning to balance flexibility, durability, and electrical performance. Key guidelines include:
Mechanical Support
Use stiffeners for local support at connector or component areas that are not intended to bend. Keep stiffeners out of the active bend zone. Review the stiffener edge, adhesive, local thickness, and distance to the rigid-to-flex transition because abrupt stiffness changes can concentrate stress.
Thermal Management
Evaluate current, temperature rise, copper cross-section, and heat paths with the operating environment. Increasing copper thickness also changes flex stiffness and strain. Review electrical, thermal, and bend requirements together rather than treating heavier copper as a universal solution.
Design for Manufacturability
Submit the revision-controlled fabrication package for review. Identify coverlay openings, rigid-to-flex transitions, resin-flow restrictions, local support, copper clearances, and panel handling requirements. Resolve drawing conflicts and record approved deviations before fabrication.
High-Quality Materials Ensuring Long Flexing Life
The bend reliability of a rigid-flex PCB depends mainly upon the material used, stack-up design, and manufacturing process. Benlida uses dependable materials in the rigid and flexible layers, thus making the rigid-flex PCB extremely flexible and mechanically strong, along with reliable electrical performance.
Polyimide (PI) Flexible Material
Polyimide is chosen for use in flexible layers of flex-rigid PCBs owing to its flexible nature, heat resistance, and mechanical strength that allow the circuit to cope with bending stress while retaining its electrical performance.
High-Performance FR-4 Material
The use of FR-4 in rigid layers provides mechanical support and strength. The use of FR-4 and flexible materials allows rigid-flex PCBs to be both rigid and flexible.
Rolled Annealed (RA) Copper
RA copper is preferred for flexible circuit areas because of its superior ductility and fatigue resistance. It helps improve bending performance and reduces the risk of copper cracking during repeated flexing.
Coverlay and Bonding Materials
Coverlay protects specified flex circuitry. Bondply or approved low-flow or no-flow bonding materials join defined layers; stiffener adhesive serves a separate local-support function. Specify openings, flow limits, thicknesses, and cure compatibility for the selected material system.
Rigid-flex PCB Manufacturing Process
Our rigid-flex PCB production follows a complete manufacturing process, including DFM review, material preparation, layer lamination, surface finishing, and electrical testing to ensure consistent quality and reliability. As a trusted rigid flex PCB supplier, we provide customized flex-rigid PCB solutions with strict process control from initial design review to final inspection.
1
Design and Release Review
Check the design revision, netlist, stack-up, bend drawing, operating conditions, and acceptance requirements. Resolve conflicts before approving the manufacturing package.
2
Material Preparation
Prepare the approved rigid and flex laminates, copper, coverlay, and bonding materials. Control material identification, storage, preparation, and processing compatibility according to the selected system.
3
Flex Circuit Patterning and Protection
Form and inspect the required flex circuit patterns. Prepare coverlay openings and apply protection at the stage specified by the construction. Check registration and clearances at exposed pads and transition boundaries.
4
Rigid-Layer and Transition Preparation
Prepare the required rigid layers and inspect their circuit patterns. Define cavities, flex windows, bonding boundaries, and transition features according to the approved build.
5
Lay-Up, Registration, and Lamination
Control layer alignment, bonding interfaces, resin flow, and the material-specific lamination cycle. Sequential builds may require repeated operations. Protect designated flex openings and keep bonding material out of restricted areas.
6
Drilling, Hole Preparation, and Metallization
Form the approved holes or microvias at the required stages. Use the material-compatible hole-wall preparation and metallization route, including desmear or plasma treatment where specified. Inspect the resulting interconnections to the agreed criteria.
7
Outer-Layer Patterning and Surface Protection
Complete the required outer-layer imaging, etching, and inspection. Apply specified solder mask, markings, and surface finishes at the approved stages. Distinguish solderable pads from connector contacts.
8
Profiling, Flex Release, and Local Support
Complete the specified outline and flex-window release without damaging the flex circuit. Add approved local stiffeners at the construction-specific stage. Check support edges, adhesive, and active-bend keepouts separately from coverlay protection.
9
Inspection and Agreed Verification
Apply the approved inspection and test plan. Bare-board electrical testing checks continuity and isolation; additional impedance or reliability verification depends on the order. Representative bend-life testing needs defined conditions, samples, and acceptance criteria.
10
Final Documentation and Packaging
Review release records and required reports. Use the agreed handling, moisture-protection, packaging, and labeling requirements for the material and shipment. Identify the part revision and lot information required by the order.
Rigid-Flex PCB Testing and Inspection
To ensure the reliability and performance of each rigid-flex PCB, we perform extensive tests and inspections during the manufacturing process. They assist in confirming electrical performance, manufacturing precision, and reliability before shipment.
Automated Optical Inspection (AOI)
AOI checks visible circuit patterns for defects within its inspection scope. It may identify pattern defects associated with opens or shorts, but it does not detect every electrical or internal fault. Continuity and isolation require the agreed electrical test method.
Electrical Testing
Electrical tests are conducted to test the continuity of the circuits, insulation efficiency, and signaling capabilities to help ensure stability of the final product.
Impedance Testing
Controlled impedance test ensures that high-speed signal needs are met in accordance with design specifications.
X-Ray Inspection
An X-ray test is utilized to examine internal structures, vias, and hidden connections within a multi-layer flex rigid PCB design.
Dimensional and Visual Inspection
Check the agreed dimensions, surface condition, coverlay openings, solder mask, finish, flex-release boundaries, and local-support positions. Use the drawing’s datums, tolerances, and acceptance criteria. Define critical measurements and report needs before production.
Quality Verification Before Shipment
Final inspection and verification are completed before shipment to ensure each rigid flex PCB supplier project meets required quality standards and production specifications.
Why Choose Benlida?
Meet Complex Design Requirements
Rigid-flex PCB designs often require higher integration and precision. Benlida helps customers achieve compact and reliable solutions by combining rigid and flexible circuit technologies into one optimized board structure.
Support Customized Applications
From consumer electronics and medical devices to high-density electronic systems, we work with customers to develop suitable flex-rigid PCB solutions based on different application requirements, space limitations, and performance needs.
Ensure Stable Quality and Performance
Our controlled manufacturing process, including DFM analysis, AOI testing, electrical testing, and quality control, can guarantee the same performance of the PCB from prototype to mass production.
Reliable Support from Development to Production
As a flexible rigid PCB manufacturer, Benlida offers full technical support for customers from design evaluation and prototype fabrication to mass production in order to minimize the risk during development and enhance manufacturing efficiency.
Industries Using Rigid-Flex PCB Solutions
With the use of rigid-flex PCB technology, industries requiring efficient and durable circuit designs can rely on this product as a solution to their needs. The combination of both rigid and flexible circuit designs makes it possible for rigid-flex PCBs to enable customers to make good use of their spaces, simplify their assembly processes, and provide products with reliable performance.
Consumer Electronics
Through the application of rigid-flex PCB technology, thin, light, and compact electronic devices like smartphones, wearables, and portable devices become possible with the proper utilization of internal spaces and a smaller number of connectors.
Medical Devices
Medical equipment requires high reliability and precise circuit integration. Rigid-flex PCB supports compact designs and stable performance for diagnostic devices, monitoring equipment, and other medical applications.
Automotive Electronics
In automotive systems, rigid-flex PCB offers great durability and vibration resistance, thus is ideal for electronic modules and applications that need to operate in harsh conditions.
Aerospace and Industrial Equipment
The use of Rigid Flex PCB will help enhance design flexibility as well as wire simplification for aerospace and industrial applications where there are issues with space restrictions and mechanical stability.
High-Density Electronic Applications
In cases where there are complicated designs or restricted installation space for products, a flex-rigid PCB is an effective solution.
Rigid-Flex PCB FAQs
Submit the complete stack-up and identify conductive layers in each rigid and flex region. The supported construction must be confirmed with materials, copper, finished thickness, vias, and bend requirements. A total layer count alone does not define feasibility, and maximum values from other PCB categories should not be applied to a rigid-flex build.
Specify the rigid and flex laminate grades, copper type, coverlay, bonding materials, and finished thicknesses. Selection depends on electrical, processing, bonding, and mechanical requirements. PI, FR-4, or RA copper alone does not define a complete material system or guarantee bend life. Proposed substitutions require review against the approved stack-up.
Provide impedance targets, tolerances, signal geometry, reference layers, and the rigid or flex regions involved. Confirm the stack-up, test structure, measurement method, and report requirements. A measured characteristic impedance result does not by itself verify the complete high-speed channel, rigid-to-flex transition, or assembled system.
Separate solderable-pad requirements from connector-contact requirements. Provide the mating connector, contact plating, finished thickness, and assembly conditions. The finish must be reviewed with thermal exposure and fine-pitch geometry. Connector contacts may be on approved rigid edges or flex tails; a rigid-edge bevel requirement does not apply to a flexible ZIF tail.
Prepare fabrication data and NC drill files, a revision-controlled fabrication drawing, the regional stack-up, material and copper requirements, and a bend drawing. State quantity, target date, finish, impedance, and acceptance requirements. If details are not final, identify the missing information. Assembly requests also need the BOM, placement data, and assembly drawing.
Provide prototype quantities, expected repeat quantities, the design revision, and the target date. Confirm the manufacturing scope and material availability for the order. Repeat builds should follow the approved stack-up and acceptance requirements, with changes recorded before production. Inspection alone does not establish identical performance between prototype and volume builds.
No. A stiffener adds local mechanical support to a flex circuit. A rigid-flex PCB integrates rigid circuit regions and flexible circuit regions into one board. Identify the conductive layers and cross-sections before selecting the service. If the design is a standalone flexible circuit with local support, review the Flexible PCB service.
Repeated movement requires a purpose-designed flex construction and a defined validation plan. Provide inside radius, complete flex thickness, angle, travel, frequency, cycles, and operating environment. A board that can fold during installation is not automatically suitable for continuous movement. Agree the test samples and acceptance criteria before assigning a service-life target.
There is no single radius to apply to every rigid-flex design. Review inside radius with complete flex thickness, layer arrangement, copper, protective materials, bend direction, and use category. Do not transfer a generic flex-PCB thickness multiplier directly into a finished rigid-flex guarantee. Provide the mechanical drawing for construction-specific review.
Use stiffeners for local connector or component support in regions that are not intended to bend. Keep them out of the active bend zone. Review the support edge, adhesive, thickness, connector engagement, and distance to the rigid-to-flex transition. A stiffener is not a remedy for excessive bending in an active flex region.
Cost and timing depend on the construction, material availability, panel utilization, quantities, fine features, lamination stages, and required verification. Provide the target date and identify critical requirements. Confirm the quotation and schedule after the manufacturing package is reviewed. Do not assume that a smaller order or fewer connectors makes the bare board cheaper.
Specify continuity and isolation requirements and any impedance, dimensional, or visual reports. If the application needs bend, thermal, adhesion, or other reliability verification, define the method, samples, conditions, and acceptance limits separately. Confirm which services and reports are included in the order; no one inspection method proves all finished-system requirements.
Ready to Review Your Rigid-Flex Project?
Prepare the current design revision, regional stack-up, bend drawing, quantity, and target date. If the design is incomplete, identify the missing information in your inquiry. Manufacturing scope and acceptance requirements need confirmation before production.